800327 – Module

Material Type:Stainless Steel

Electrostatic Force Adjustment Range:± 500 mN

Vacuum Compatibility:Up to 10 Torr

Temperature Range:-40°C to +250°C

Diameter:8 inches

Height:1 inch

Electrode Configuration:Dual Electrode Design

    Introducing the LAM 839-800327-315 Electrostatic Chuck, an indispensable component in semiconductor manufacturing, tailored for precision bonding operations. Crafted from premium stainless steel, this chuck ensures durability and resistance against corrosion, maintaining its performance under rigorous manufacturing conditions.

    Equipped with advanced electrostatic force adjustment capabilities, the LAM 839-800327-315 offers variable force settings, allowing for optimal bonding pressure according to the specific needs of various wafer materials. This feature guarantees a consistent bond quality across a wide range of applications.

    Operating within a temperature range of -40°C to 200°C, the chuck is designed for flexibility in diverse manufacturing environments. Its exceptional vacuum holding capacity of up to 100mm Hg ensures stable and secure wafer positioning during bonding processes.

    The adjustable electrostatic force allows manufacturers to tailor the force applied during bonding, significantly enhancing the reliability and repeatability of their production lines. This feature is crucial for achieving high yields and minimizing defects in semiconductor fabrication.

    Featuring a compact yet robust design, the LAM 839-800327-315 measures 200mm x 200mm x 50mm, fitting seamlessly into modern manufacturing setups. Its DC 24V power supply ensures compatibility with a wide array of automation systems, simplifying integration into existing production lines.

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