CPU Type:316-2DP
Processor Speed:Up to 4 MHz
Memory:8 KB RAM, 32 KB ROM
Communication Interface:Profibus DP, Profinet
Operating Voltage:12 to 48 V DC
Temperature Range:-25°C to +60°C
Dimensions:100 x 116 x 120 mm
Weight:0.4 kg
The SIEMENS 6ES7316-2AG00-0AB0 CPU 316-2DP Processor Module is engineered for high reliability and efficiency in industrial automation systems. It leverages cutting-edge microcontroller technology to deliver exceptional processing speed, enabling seamless integration with various industrial protocols including MPI and PROFINET. With its robust memory system, it ensures ample storage for critical applications, while its wide operating temperature range makes it suitable for use in harsh industrial environments.
Featuring an advanced data processing speed of up to 200K instructions per second, this module significantly enhances operational throughput, allowing manufacturers to optimize production lines and improve overall efficiency. Its 32 KB of RAM and 2 KB of EEPROM provide ample space for storing program code and user data, ensuring smooth operation even under heavy load conditions.
Built with precision and durability in mind, the 6ES7316-2AG00-0AB0 is designed to withstand the rigors of industrial settings, offering protection against dust, moisture, and extreme temperatures. Its compact dimensions make it easily integrable into existing control panels without compromising on functionality or space.
For users seeking to enhance their automation capabilities, this module offers unparalleled flexibility and performance. Whether you’re a seasoned engineer looking to upgrade existing systems or a newcomer to industrial automation, the SIEMENS 6ES7316-2AG00-0AB0 is the ideal choice to drive your projects forward.
Backed by Siemens’ commitment to quality and innovation, this processor module comes with comprehensive support and extensive documentation, ensuring a smooth setup and operation process. It’s designed to be compatible with a wide array of Siemens and third-party devices, facilitating easy integration and scalability.
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